GOST 2.123-93 Unified system for design documentation.In Russia, there are standards for the design documentation of printed circuit boards in the framework of the Unified system for design documentation: The design process itself is often referred to as the slang word wiring, implying the process of wiring. The most famous are P-CAD, OrCAD, TopoR, Altium Designer, Specctra, Proteus, gEDA, KiCad, etc. The design of boards takes place in specialized computer-aided design programs. In this case, the metal base plate is attached to the radiator.Īs a material for printed circuit boards operating in the microwave range and at temperatures up to 260 ° C, fiberglass-reinforced fluoroplastic (for example, FAF-4D) and ceramics are used.įlexible boards are made from polyimide materials such as Kapton. Such printed circuit boards are used in power electronics for efficient heat removal from electronic components. The basis of the printed circuit board is a dielectric, the most commonly used materials such as glass fiber, getinaks.Īlso, the basis of printed circuit boards can serve as a metal base coated with a dielectric (for example, anodized aluminum), a copper foil of tracks is applied over the dielectric. Printed circuit boards may have their own characteristics, due to their purpose and requirements for special operating conditions (for example, an extended temperature range ) or application features (for example, boards for devices operating at high frequencies ). Īccording to the properties of the base material : Multilayer printed circuit boards are obtained by gluing together several single-sided or double-sided boards Īs the complexity of the designed devices and installation density increases, the number of layers on the boards increases. multilayer (WFP): foil not only on both sides of the board, but also in the inner layers of the dielectric.double-sided (DPP): two layers of foil.
unilateral (OPP): there is only one layer of foil glued to one side of the dielectric sheet.Types of printed circuit boardsĭepending on the number of layers with a conductive pattern, printed circuit boards are divided into:
From the external sides, a protective coating (“solder mask”) and marking (auxiliary drawing and text according to the design documentation) are usually applied to the board. In addition, in the printed circuit boards there are vias for the electrical connection of the foil sections located on different layers of the board. The printed circuit board contains mounting holes and contact pads for mounting of pin or planar components. In contrast to mounted installation, on a printed circuit board, the electrically conductive pattern is made of foil, which is entirely located on a solid insulating base.
Brown stripes - copper tracks and vias (English) Russian. A silicon crystal can be seen from above. A cut of a multi-layer printed circuit board with a microchip in the BGA package.